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On the scaling of an ion-implanted silicon MESFET

dc.contributor.authorChatttopadhyay S.N.; Pal B.B.
dc.date.accessioned2025-05-24T09:57:55Z
dc.description.abstractAn ion-implanted silicon MESFET is scaled to smaller sizes assuming constant field within the device. Ion implantation is a leading techn.ology for VLSI and scaling is an important tool for device miniaturization. A one-dimensional and fairly accurate analysis is carried out considering the effect of side walls in the space-charge region below the gate in the below pinch-off region. Different device parameters such as drain-source current, threshold voltage, time delay, frequency, d.c. power dissipation and switching energy are plotted and discussed with respect to scaling factor for α. The results show how the ion-implanted silicon MESFET device can be optimized with the ad of scaling factor for better device performance. © 1989.
dc.identifier.doihttps://doi.org/10.1016/0038-1101(89)90177-9
dc.identifier.urihttp://172.23.0.11:4000/handle/123456789/22706
dc.relation.ispartofseriesSolid State Electronics
dc.titleOn the scaling of an ion-implanted silicon MESFET

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