Investigation on mixing heat effect of bi-in and in-sn system at 730 K

Abstract

In automotive industries, the circuit boards placed inside the vehicle experience greater thermal stress due to temperature in the excess of 150°C. It can be minimise by replacing hazardous Pb in Sn-Pb solder alloy, which reflect the development of Pb free solder alloy. Formation of alloy depends on its phase diagram followed by measurement of its thermodyanamical properties. In this work, investigation of mixing heat effect (mixing enthalpy) as partial enthalpy and integral enthalpies of mixing in liquid phase Bi-In and In-Sn system have been carried out at ambient temperature (730 K) by a drop Calorimeter over the entire composition of indium. The plot of enthaplyies enthalpies of mixing are plotted against indium and found exothermic in nature for all the compositions. The experimental data were used to determine the binary interaction parameters at 730 K and it is used to calculate the Redlich -Kister polynomial and compared with our experimental data. It has been observed that model value was close to experimental data for all compositions at 730 K. © 2019 Elsevier Ltd.