Effects of CuO/water nanofluid application on thermal performance of mesh wick heat pipe
| dc.contributor.author | Gupta N.K.; Verma S.K.; Rathore P.K.S.; Sharma A. | |
| dc.date.accessioned | 2025-05-23T11:30:11Z | |
| dc.description.abstract | The present investigation deals with the effect of CuO/water nanofluid on the thermal performance of a heat pipe. The impact of CuO/water nanofluid application on the heat pipe for a wider range of input power (50-150 W) and inclination angle (0°, 15°, 30°, 45°, 60°, 75°, and 90° from horizontal) have been analyzed. Experimental findings confirm 20.5% decrease in thermal resistance and 15.3% increment in thermal efficiency of the heat pipe compared to water. Maximum thermal efficiency (66.5%) of a heat pipe was obtained at 150 W and 1.0 vol.% of nanofluid in a horizontal position. Investigation establishes that a 30° inclination angle is the most favorable one for the optimum enhancement of thermal performance of a heat pipe. © 2020 by Begell House, Inc. | |
| dc.identifier.doi | https://doi.org/10.1615/HEATTRANSRES.2020030772 | |
| dc.identifier.uri | http://172.23.0.11:4000/handle/123456789/11876 | |
| dc.relation.ispartofseries | Heat Transfer Research | |
| dc.title | Effects of CuO/water nanofluid application on thermal performance of mesh wick heat pipe |