Effect of In, Al, and Cu Addition on Corrosion behavior of Sn-based Ternary Lead-free Solder Alloys
| dc.contributor.author | Jaiswal, Dheeraj | |
| dc.date.accessioned | 2023-07-13T05:22:25Z | |
| dc.date.available | 2023-07-13T05:22:25Z | |
| dc.date.issued | 2022 | |
| dc.description | This thesis is submitted by Dheeraj Jaishwal of IIT(BHU),Varanasi under the supervision of Dr. C.K Behera . | en_US |
| dc.description.abstract | Abstract is available in the attachment. | en_US |
| dc.identifier.other | TH1032 | |
| dc.identifier.uri | https://idr-sdlib.iitbhu.ac.in/handle/123456789/2435 | |
| dc.language.iso | en_US | en_US |
| dc.publisher | IIT(BHU) Varanasi | en_US |
| dc.rights.license | CC BY-NC-SA 4.0 | |
| dc.subject | Addition | en_US |
| dc.subject | Corrosion | en_US |
| dc.subject | Sn-based | en_US |
| dc.subject | Ternary | en_US |
| dc.title | Effect of In, Al, and Cu Addition on Corrosion behavior of Sn-based Ternary Lead-free Solder Alloys | en_US |
| dc.type | Thesis | en_US |
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