Inspection of dynamic fracture behavior of multiple interfacial cracks emanating from circular holes in functionally graded piezoelectric bi-materials

Abstract

An effective approach for the dynamic investigation of multiple interfacial cracks that emanate from circular holes in two bonded semi-infinite functionally graded piezoelectric materials (FGPM) has been devised. The interfacial cracks are considered to be permeable and are under the influence of steady-state SH waves. The boundary conditions are solved by utilizing the Green's function approach. The mechanical model of the interfacial cracks is constructed with the help of crack-conjunction and crack-deviation approaches that yield a series of first-kind Fredholm integral equations. Direct numerical integration of the series of equations aids in obtaining the analytical form of dynamic stress intensity factors (DSIFs) at the left and right crack tips. Furthermore, the findings of this article are also corroborated. The remarkable feature of this study is the visual presentation of the consequence of functionally graded parameter ratio, distance between cracks, interfacial cracks' length ratio, incident angle, and wave number on DSIFs. © 2025 Elsevier Inc.