Measurements of Enthalpies of Mixing of Sn–Ga–In Ternary Alloy System by Calorimetric Technique

Abstract

The ultimate objective of this study is to find a way to replace toxic lead-based solder with a non-toxic replacement that retains all of the desirable characteristics of the conventional solder. In this work, the integral and partial enthalpy of mixing for Sn–Ga–In ternary alloy systems were measured by the help of drop calorimeter along six of the cross sections at different temperatures of 673 K, 723 K and 773 K. Pieces of pure tin were dropped into molten Ga0.25In0.75, Ga0.50In0.50, Ga0.75In0.25 alloys and pieces of pure Indium into Ga0.25Sn0.75, Ga0.50Sn0.50, Ga0.75Sn0.25. In order to calculate the interaction parameter, Redlich–Kister–Muggianu (RKM) model was used which considers the substitutional solution mechanism. Geometric models i.e. Kohler, Muggianu, Chou, Toop, and Hillert have been used to determine the integral mixing enthalpies and compared with experimental data. It has been seen a good agreement between the theoretical models and results of this study. © The Author(s) under exclusive licence to The Korean Institute of Metals and Materials 2024.